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Imec's 2026 roadmap details 0.3nm nodes by 2038, CFET transistors become viable at 0.7nm

Imec's latest production node roadmap shows that the international research and development organization envisions 3 angstrom-class (0.3nm) fabrication technologies by 2038, but expects contact poly pitch (CPP) to stop scaling at A10 in 2030. While things might not be looking great for Moore's Law for imec, to continue scaling the chipmaker will need to adopt new technologies, such as CFET transistors and likely Hyper-NA EUV Lithography systems . This piece sits on 1 source layers, but the real value is showing why the story should not be skimmed past too quickly.

Imec's latest production node roadmap shows that the international research and development organization envisions 3 angstrom-class (0.3nm) fabrication technologies by 2038, but expects contact poly pitch (CPP) to stop scaling at A10 in 2030. While things might not be looking great for Moore's Law for imec, to continue scaling the chipmaker will need to adopt new technologies, such as CFET transistors and likely Hyper-NA EUV Lithography systems . The signal is strong enough to deserve attention, but it still needs to be read as something developing rather than fully settled.

Emerging The topic has initial corroboration, but the newsroom is still waiting on stronger confirmation.
Reference image for: Imec's 2026 roadmap details 0.3nm nodes by 2038, CFET transistors become viable at 0.7nm
Reference image from Tom's Hardware. Tom's Hardware

Imec's latest production node roadmap shows that the international research and development organization envisions 3 angstrom-class (0.3nm) fabrication technologies by 2038, but expects contact poly pitch (CPP) to stop scaling at A10 in 2030. While things might not be looking great for Moore's Law for imec, to continue scaling the chipmaker will need to adopt new technologies, such as CFET transistors and likely Hyper-NA EUV Lithography systems . As the production of semiconductors becomes substantially more complicated, chipmakers no longer introduce all-new process technologies every couple of years. Tom's Hardware is the main source layer for now, and the rest should be read as a signal that is still widening. On the device side, the useful angle is whether a technical change actually alters feel, lifespan, or upgrade cost in real use.

What is happening now

Imec's latest production node roadmap shows that the international research and development organization envisions 3 angstrom-class (0. 3nm) fabrication technologies by 2038, but expects contact poly pitch (CPP) to stop scaling at A10 in 2030. Tom's Hardware form the main source layer behind the core facts in this piece. This is still a developing thread, so the useful part is knowing which source signals are hardening and which ones still need caution. With devices, practical impact usually shows up in battery life, heat, stability, and long-term usability rather than in a few flashy headline numbers.

Where the sources line up

Tom's Hardware is the main source layer for now, and the rest should be read as a signal that is still widening. While things might not be looking great for Moore's Law for imec, to continue scaling the chipmaker will need to adopt new technologies, such as CFET transistors and likely Hyper-NA EUV Lithography systems . Tom's Hardware form the main source layer behind the core facts in this piece.

The details worth keeping

As the production of semiconductors becomes substantially more complicated, chipmakers no longer introduce all-new process technologies every couple of years. On the device side, the useful angle is whether a technical change actually alters feel, lifespan, or upgrade cost in real use. The readers who should care most are the ones planning to replace a device, buy an accessory, or upgrade a work setup in the next few months. The next step is to see whether the current signals harden into a durable change or fade as a short-lived experiment.

Why this matters most

The signal is strong enough to deserve attention, but it still needs to be read as something developing rather than fully settled. With 1 source layers on the table, the part worth reading most closely is where firm facts meet the market's early reaction. Instead, they typically roll out a new node generation every three years, with annual incremental enhancements in between.

What to watch next

The next readout is price, device coverage, and whether the change feels real once the hardware reaches users. Patrick Tech Media will keep checking rollout speed, user reaction, and how Tom's Hardware update the next pieces. From 1 early signals, the piece keeps 1 references that are useful for locking the main details in place. That is why the useful reading move is not to stop at the headline, but to compare the promise, the workflow change, and the likely cost before deciding anything.

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